february 2010 doc id 11639 rev 3 1/8 8 emif07-lcd02f3 7-line ipad?, emi filter and esd protection for lcd and cameras features emi symmetrical (i/o) low-pass filter high efficiency in emi filtering lead-free package very low pcb space occupation: 1.94 mm x 1.54 mm very thin package: 0.65 mm high efficiency in esd suppression high reliability offered by monolithic integration high reduction of parasitic elements through integration and wafer level packaging complies with the following standards iec 61000-4-2 level 4 on inputs and outputs: ? 15 kv (air discharge) ? 8 kv (contact discharge) mil std 883g - method 3015-7 class 3 applications where emi filtering in esd sensitive equipment is required: lcd for mobile phones computers and printers communication systems mcu boards description the emif07-lcd02f3 is a 7-line highly integrated device designed to suppress emi/rfi noise in all systems subjected to electromagnetic interference. the emif07 flip chip package means the package size is equal to the die size. this filter includes esd protection circuitry, which prevents damage to the protected device when subjected to esd surges up 15 kv. figure 1. pin layout (bump side) figure 2. device configuration tm : ipad is a trademark of stmicroelectronics. flip chip (18 bumps) a b c d 1 2 3 4 5 o1 o2 o3 o4 o6 i5 o5 o7 i1 i2 i3 i7 i6 i4 gnd gnd gnd gnd input gnd gnd gnd output low-pass filter ri/o = 70 cline = 30 pf www.st.com
characteristics emif07-lcd02f3 2/8 doc id 11639 rev 3 1 characteristics table 1. absolute maximum ratings (t amb = 25 c) symbol parameter and test conditions value unit t j maximum junction temperature 125 c t op operating temperature range -40 to +85 c t stg storage temperature range -55 to 150 c table 2. electrical characteristics (t amb = 25 c) symbol parameters v br breakdown voltage i rm leakage current @ v rm v rm stand-off voltage v cl clamping voltage i pp peak pulse current r i/o series resistance between input and output c line input capacitance per line symbol test conditions min typ max unit v br i r = 1 ma 6 8 10 v i rm v rm = 3 v 50 200 na r 2 tolerance 20% 70 c line vline = 0 v, v osc = 30 mv, f =1 mhz 30 pf i v i f i rm i r i pp v rm v f v br v cl
emif07-lcd02f3 characteristics doc id 11639 rev 3 3/8 figure 7. line capacitance versus applied voltage figure 3. attenuation measurement and aplac simulation figure 4. analog cross talk measurement 100.0k 1.0m 10.0m 100.0m 1.0g -50.00 -40.00 -30.00 -20.00 -10.00 0.00 line 1 line 2 line 3 line 4 line 5 line 6 line 7 db f (hz) 100.0k 1.0m 10.0m 100.0m 1.0g -100.00 -90.00 -80.00 -70.00 -60.00 -50.00 -40.00 -30.00 -20.00 -10.00 0.00 xtalk 1/2 100.0k 1.0m 10.0m 100.0m 1.0g -100.00 -90.00 -80.00 -70.00 -60.00 -50.00 -40.00 -30.00 -20.00 -10.00 0.00 xtalk 1/2 100.0k 1.0m 10.0m 100.0m 1.0g -100.00 -90.00 -80.00 -70.00 -60.00 -50.00 -40.00 -30.00 -20.00 -10.00 0.00 db xtalk 1/2 f (hz) figure 5. voltages when iec 61000-4-2 (+15 kv air discharge) applied to input pin figure 6. voltages when iec 61000-4-2 (-15 kv air discharge) applied to input pin 10 v/div input 10 v/div 100 ns/div outpu t 10 v/div input 10 v/div 100 ns/div output 0 5 10 15 20 25 30 0123456 v (v) line c (pf) line
application information emif07-lcd02f3 4/8 doc id 11639 rev 3 2 application information figure 8. aplac model figure 9. aplac parameters model = d2 rline model = d1 lbump rbump lbump rbump bulk i1 o1 model = d3 rbump lbump cbump rgnd lgnd bulk rbump lbump cbump rgnd lgnd rbump lbump cbump rgnd lgnd rbump lbump cbump rgnd lgnd aplacvar rline 70 aplacvar c_d1 15p aplacvar c_d2 15p aplacvar c_d3 600p aplacvar ls 950ph aplacvar rs 150m aplacvar lbump 50ph aplacvar rbump 20m aplacvar cbump 150f aplacvar lgnd 50ph aplacvar rgnd 100m aplacvar rsub 10m diode d1 bv=7 ibv=1m cjo=c_d1 m=0.28 rs=0.1 vj=0.6 tt=100n diode d2 bv=7 ibv=1m cjo=c_d2 m=0.28 rs=0.1 vj=0.6 tt=100n diode d3 bv=7 ibv=1m cjo=c_d3 m=0.28 rs=0.01 vj=0.6 tt=100n
emif07-lcd02f3 ordering information scheme doc id 11639 rev 3 5/8 3 ordering information scheme figure 10. ordering information scheme 4 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 11. package dimensions emif yy - xxx zz f3 emi filter number of lines information package x = resistance value (ohm) z = capacitance value / 10 (pf) or 3 letters = application 2 digits = version f = flip chip 3 = lead-free, pitch = 400 m, bump = 255 m 605 m 55 1.94 mm 30m 1.54 mm 30 m 255 m 40 400 m 40 400 m 40 170 m 170 m
ordering information emif07-lcd02f3 6/8 doc id 11639 rev 3 figure 14. flip chip tape and reel specification note: more information is availa ble in the application notes: an2348: ?stmicroelectronics 400 micro-metre flip chip : package description and recommendation for use? an1751: ?emi filters: recommendations and measurements? 5 ordering information figure 12. footprint figure 13. marking 220 m recommended 220 m recommended 260 m maximum solder stencil opening: copper pad diameter: solder mask opening: 300 m minimum x y x w z w dot, st logo ecopack status xx = marking z = manufacturing location yww = datecode (y = year ww = week) dot identifying pin a1 location user direction of unreeling all dimensions in mm 4.0 0.1 4.0 0.1 2.0 0.05 8.0 0.3 1.75 0.1 3.5 0.1 ? 1.55 0.1 0.69 0.05 1.71 0.20 0.02 2.08 st xxz yww st xxz yww st xxz yww table 3. ordering information order code marking package weight base qty delivery mode emif07-lcd02f3 gx flip chip 3.9 mg 5000 tape and reel 7?
emif07-lcd02f3 revision history doc id 11639 rev 3 7/8 6 revision history table 4. document revision history date revision changes 12-sep-2005 1 first issue. 28-apr-2008 2 updated ecopack statement. updated figure 10 , figure 11 and figure 14. reformatted to current standards. 19-feb-2010 3 updated die size in figure 11 .
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